Electronic Materials Innovations and Reliability in Advanced Memory Packaging
Original price was: $159.00.$119.25Current price is: $119.25.
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging – from component to system level.
| Book Author | Chen Yu Huang, Chong Leong Gan |
|---|---|
| ISBN | 9783031947940 |
| Language | English |
| Publisher | Springer |
| Publication Date | 07-22-2025 |
| Format | eBook |
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